The HT-FSS330A is a compact three-station selective wave soldering machine: spray, preheat and solder in one 240 kg frame. It takes PCBs up to 300 x 300 mm with a single 15 kg solder pot, an electromagnetic wave pump and ±1 °C pot temperature control.
| Model | HT-FSS330A |
| Dimension | L800 × W940 × H1900 mm |
| Max PCB Size | 300 × 300 mm |
| PCB Thickness | 0.2-6 mm |
| PCBA Max. Weight | 10 kg (customizable) |
| PCBA Height (Topside) | 280 mm max |
| PCBA Height (Bottom Side) | 80 mm max |
| PCB Edge Width | ≥ 5 mm |
| Solder Pots | 1 |
| Programming | Panoramic image / real-time image / manual programming |
| Barcode Scan | CCD scanning |
| Power Consumption | 220 VAC / 3 kW |
| Operating Power | 1 kW |
| Weight | 240 kg |
| Conveyor Width | 300 mm |
| Conveyor Height | 70 mm |
| Travel Axis | X, Y, Z |
| Spray Type | Spot / line spraying |
| Preheat Method | Air (customizable) |
| Preheat Temperature | 25-250 °C |
| Wave Drive Method | Electromagnetic pump |
| Solder Capacity | 15 kg |
| Solder Pot Temperature | 350 °C |
| Melt Time | ≤ 75 min (electromagnetic pump) |
| Flux Capacity | 1 L |
The HT-FSS330A is the compact selective wave soldering machine: spray fluxer, preheater and solder pot sit in one 800 x 940 mm frame so a single operator loads at one end and unloads at the other. PCBs up to 300 x 300 mm and 6 mm thick are accepted, with 280 mm clearance above the board and 80 mm below it.
A single 15 kg solder pot driven by an electromagnetic pump is held at 350 °C by an advanced control algorithm that keeps the pot within ±1 °C. The machine runs on 220 VAC / 3 kW with 1 kW operating power and draws 1 L of flux.
