The HT-LAB730 is a laser solder-ball soldering robot: a fibre laser melts pre-placed solder balls with no flux, no cleaning and no stencil. 6-axis gantry, 0-300 W laser, 0.2-1.8 mm ball range and ±0.01 mm repeat accuracy.
| Model | HT-LAB730 |
| Dimension | L980 × W1100 × H1750 mm |
| Travel Range | X500 / Y650 / Z80 + 80 mm |
| Product Max. Size | 200 × 300 mm |
| Control Method | IPC |
| Drive Mode | Servo Motor / Ball Screw |
| Number of Axis | 6 Axes |
| Laser Power Range | 0-300 W |
| Laser Type | Fibre laser |
| Travel Maximum | 1000 mm/s |
| Average Power Consumption | 450 W |
| Max Power Consumption | 185-265 V / 1500 W |
| Repeat Position Accuracy | ±0.01 mm |
| Diameter of Solder Ball | 0.2-1.8 mm |
| Minimum Soldering Distance | 0.2 mm |
| Nitrogen Pressure | 3-12 bar |
| Nitrogen Flow Rate | 0.75 L/min |
| Weight | 700 kg |
The HT-LAB730 solders with solder balls instead of wire: a fibre laser melts a ball that has been placed on the joint, so the process needs no flux, no cleaning and no stencil. Because heat is applied only where the ball sits, the thermal load on the board and its neighbours stays low.
A 6-axis servo / ball-screw gantry covers 500 x 650 mm with two Z axes of 80 mm, and the 0-300 W fibre laser melts balls from 0.2 mm to 1.8 mm at ±0.01 mm repeat accuracy. Nitrogen is supplied at 3-12 bar and 0.75 L/min to shield the joint; pattern recognition, fiducial alignment, automatic height measurement and automatic calibration keep the spot on target.
