The HT-LPS730 is a laser soldering robot for solder paste or solder wire: non-contact regional heating with low thermal stress, a 0-300 W semiconductor laser, 5-150 µm solder powder and ±0.02 mm repeat accuracy on a 6-axis gantry.
| Model | HT-LPS730 |
| Dimension | L980 × W1100 × H1750 mm |
| Travel Range | X500 / Y650 / Z80 + 80 mm |
| Product Max. Size | 200 × 300 mm |
| Control Method | IPC |
| Drive Mode | Servo Motor / Ball Screw |
| Number of Axis | 6 Axes |
| Laser Power Range | 0-300 W |
| Laser Type | Semiconductor laser |
| Travel Maximum | 1000 mm/s |
| Average Power Consumption | 450 W |
| Max Power Consumption | 185-265 V / 1500 W |
| Repeat Position Accuracy | ±0.02 mm |
| Diameter of Solder Ball | 0.3-2.0 mm |
| Solder Powder Size | 5-150 µm (Type 1-6) |
| Minimum Soldering Distance | 0.2 mm |
| Work Environment | 0-40 °C, 10%-90% RH |
| Weight | 700 kg |
The HT-LPS730 is the solder-paste and solder-wire version of the laser platform: the head dispenses paste or feeds wire, then heats only the joint area with a 0-300 W semiconductor laser. Because heat is applied regionally and non-contact, the thermal stress on the board and on adjacent parts is low.
The laser can be switched on and off fast enough to control the heat input precisely, and the spot size can be customised so several joints are soldered in one pass. CCD locating combined with laser distance measuring keeps placement at ±0.02 mm, and the working area is enclosed with laser safety windows.
