The HT-SEL1000C selective wave soldering machine solders through-hole joints on 500 x 500 mm boards. Two stations (spray and solder), one or two 15 kg pots, a mechanical or electromagnetic wave pump and ±1 °C pot temperature control.
| Model | HT-SEL1000C |
| Dimension | L1400 × W1600 × H1750 mm |
| Max PCB Size | 500 × 500 mm |
| PCB Thickness | 0.2-6 mm |
| PCBA Max. Weight | 15 kg (customizable) |
| PCBA Height (Topside) | 100 mm max |
| PCBA Height (Bottom Side) | 60 mm max |
| PCB Edge Width | ≥ 5 mm |
| Solder Pots | 1 (standard) / 2 (optional) |
| Programming | Panoramic image / real-time image / manual programming |
| Barcode Scan | CCD scanning |
| Power Consumption | 380 VAC / 12 kW |
| Operating Power | 2.5-3 kW |
| Weight | 1000 kg |
| Conveyor Width | 100-500 mm |
| Conveyor Height | 900 ± 20 mm |
| Travel Axis | X, Y, Z (single pot) / X, Y, Z1, Z2 (double pot) |
| Spray Type | Spot / line spraying (optional) |
| Preheat Method | Air |
| Preheat Temperature | 25-250 °C |
| Wave Drive Method | Mechanical pump / electromagnetic pump (optional) |
| Solder Capacity | 15 kg |
| Solder Pot Temperature | 350 °C |
| Melt Time | ≤ 75 min (electromagnetic) / ≤ 30 min (mechanical) |
The HT-SEL1000C is a two-station selective wave soldering machine: flux is sprayed and the board is soldered, with no separate preheat station. It accepts PCBs up to 500 x 500 mm and 6 mm thick, 100 mm of top-side clearance and 60 mm below, with a conveyor width adjustable from 100 mm to 500 mm at 900 mm working height.
One 15 kg solder pot is standard and a second is optional; the wave is driven by a mechanical pump, or an electromagnetic pump if requested. Spray head and solder nozzle clean themselves, and the temperature algorithm holds the pot at ±1 °C for consistent through-hole joints.
