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HT-SEL400C

HT-SEL400C

Selective Wave Soldering Machine
Selective wave soldering

The HT-SEL400C selective wave soldering machine runs online or offline with five-minute programming. Three stations (spray, preheat and solder) handle 500 x 500 mm boards with a single or double 15 kg pot and multi-point temperature measurement.

Specification

ModelHT-SEL400C
DimensionL1400 × W1600 × H1750 mm
Max PCB Size500 × 500 mm
PCB Thickness0.2-6 mm
PCBA Max. Weight15 kg (customizable)
PCBA Height (Topside)100 mm max
PCBA Height (Bottom Side)60 mm max
PCB Edge Width≥ 5 mm
Solder Pots1 (standard) / 2 (optional)
ProgrammingPanoramic image / real-time image / manual programming
Barcode ScanCCD scanning
Power Consumption380 VAC / 18 kW
Operating Power2.5-2.8 kW
Weight1100 kg
Conveyor Width100-400 mm
Conveyor Height900 ± 20 mm
Travel AxisX, Y, Z (single pot) / X, Y, Z1, Z2 (double pot)
Spray TypeSpot / line spraying
Preheat MethodAir + infrared
Preheat Temperature25-250 °C
Wave Drive MethodMechanical pump / electromagnetic pump (optional)
Solder Capacity15 kg
Solder Pot Temperature350 °C
Melt Time≤ 75 min (electromagnetic) / ≤ 30 min (mechanical)
Flux Capacity2 L
Alcohol Capacity2 L

Product Description

The HT-SEL400C is the flexible member of the selective wave range: it can run as an online machine in a conveyor line or as a stand-alone offline cell, and it switches between the two modes in software. Three stations (spray, preheat with air plus infrared, and soldering) handle boards up to 500 x 500 mm.

A program can be built in about five minutes and copied between machines without a board present, nozzles are meant to be swapped without hassle, and multi-point real-time temperature measurement keeps the pot at ±1 °C. Conveyor width adjusts from 100 mm to 400 mm at 900 mm working height.

HT-SEL400C product description

Advantages & Highlights

  • Freely switchable online / offline mode: one machine for both line and cell use.
  • Three stations: spray, preheat and soldering.
  • Compact footprint, suitable for small batch production.
  • Multi-point real-time temperature measurement.
  • Five-minute rapid programming and zero-load program copy.
  • Zero-hassle nozzle replacement.
  • Single or double solder pot, mechanical or electromagnetic wave pump.

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